LNA operation over Broadband applications
WanTcom provides exceptional LNA operation
over broadband widths by performing the matching of the
GaAs device at the die level, not outside the package
as many semiconductor manufacturers force upon you. Read
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RF Gain Stage temperature compensation
Yantel Temp Comp Chip Attenuators improve
reliability through component reduction and self-limiting
current consumption in small signal applications. Read
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RF Power Amps operate cooler
Improving system level reliability through the use of
ATC Ultra-Low ESR Ceramic RF Capacitors
used in matching networks. Read
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Lowest possible circuit costs achieved through
Practical Capacitor Tolerance Selection of your Coupling,
DC Blocking and Bypass RF Capacitors… Read
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Careful analysis of frequency dependent
properties
In RF Caps during the selection process will result in
optimized circuit performance in broadband. Read
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Calculation of effective capacitance vs frequency
Impedance matching applications where minimum temperature
drift is critical, this approach will save time and money…
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Thermal Management in RF Power Amplifiers
A few quick calculations of the dissipated power in the
RF Cap is critical, so knowing the ESR and matching impedances
are key to achieving trouble free operation in power amplifier
circuits. Read
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Thermal Considerations Power Resistive Products
Substrate material changes due to health concerns lead
to in-depth research on how to make thermal measurements.
The elimination of BeO from RF Resistive products resulted
in a materials analysis before you can be assured of a
reliable design in your coupler or ferrite isolator application…
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The single most important parameter
Equivalent Series Resistance (ESR) is the most important
parameter in selecting an RF Cap to fit the application.
It is the summation of all losses resulting… Read
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Component Mechanical placement Orientation
Many RF Chip Caps are typically surface mounted on a microstrip.
Mounting can be with the electrodes parallel or perpendicular
to the microstrip… Read
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Understanding TCC of RF Ceramic Chip Caps
Temperature Coefficient of Capacitance (TCC) of SMT MLC
devices are used to offset temperature performance of
competing components in the circuit… Read
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Current rating curves of MLC RF Chip Caps
Information and methods for arriving at RF current ratings
of MLC show that the general shape of the current rating
curves can be established for Dielectric Properties… Read
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Building an accurate RF MLC small
signal model
It is always a good idea to know and understand the measurement
setup and testing techniques employed to acquire the data
to be used in modeling software… Read
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Long term Aging, do you know your epsilon
Capacitor Aging describes an effect exhibited by ferroelectric
class dielectric materials in which barium titanate (BaTiO3)
is the main constituent. Dielectric permittivity decay,
epsilon (ε), is noted over time with these formulations…
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High Q RF Caps in Matching Applications
Next to the output transistor operating in most class
A or AB approaches, the Shunt C position is the biggest
heat generator in the power amplifier circuit, so give
it the attention that it needs to optimize and minimize
thermal rise. Read
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Too much pressure is not good on your RF Caps
The Greek root of the word piezo means "to press". In
1880, Jacques and Pierre Curie discovered that pressure
applied to a quartz crystal creates an electrical potential
on the crystal. Likewise, they also discovered that an
electrical potential impressed on the crystal creates.
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Calculations for RF Coax Designs
Calculate the Impedance, Phase, Capacitance, Delay, Velocity
of Propagation & Attenuation of a coax design… Read
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Extended NaS Battery Life with Ultracaps
Ioxus Ultracaps can extend the life of
expensive sodium-sulfur high energy battery farms. Read
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Locomotive Diesel Engine Cranking Currents
Ioxus Ultracaps provide assist to high
energy cranking applications like locomotive diesel engine
start-ups or EV motor demand during acceleration. Read
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