Technical Articles covering Active and Passive RF Component design
support for the RF Design Engineer as well as Power Conversion design support topics.
|
|
|
LNA Operation over BB Applications
WanTcom provides exceptional LNA operation
over broad bandwidths by performing the device matching at the
semiconductor die level, not outside the package, which
adds packaging parasitics that destroy your circuit match. Read
More>> |
Understanding TCC of RF MLC Chip Caps
Temperature Coefficient of Capacitance (TCC) of SMT MLC
devices are used to offset temperature performance of
competing components in the circuit. Read
More>> |
RF Gain Stage temperature compensation
Yantel Temp Comp Chip Attenuators improve
reliability through component reduction and self-limiting
current consumption in small signal applications. Read
More>> |
Current rating curves of MLC RF Chip Caps
Information and methods for arriving at RF current ratings
of MLC show that the general shape of the current rating
curves can be established for a variety of Ceramic Dielectric Properties. Read
More>> |
|
Building an accurate RF MLC Mmodel
It is always a good idea to know and understand the measurement
setup and testing techniques employed to acquire the exacting test data
used to build simulation models. Read
More>> |
RF Power Amplifiers operate cooler
Improving system level reliability through the use of ATC Ultra-Low ESR Ceramic RF Capacitors
used in matching networks for your amplifiers. Read
More>> |
Long term Aging, find your epsilon
Capacitor Aging describes an effect exhibited by ferroelectric
class dielectric materials in which barium titanate (BaTiO3)
is the main constituent. Dielectric permittivity decay,
epsilon (ε), is noted over time with these formulations.
Read
More>> |
Lowest possible circuit costs achieved
Practical RF Capacitor Tolerance Selection for Coupling,
DC Blocking and Bypass applications are critical. Read
More>> |
High Q RF Caps in Matching Applications
Next to the output transistor operating in most class
A or AB approaches, the Shunt C position is the biggest
heat generator in the power amplifier circuit, so give
it the attention that it needs to optimize and minimize
thermal rise. Read
More>> |
Careful analysis of dependent
properties
In RF Caps during the selection process will result in
optimized circuit performance of broadband circuits. Read
More>> |
Mechanical pressure can kill your RF Cap
The Greek root of the word piezo means "to press". In
1880, Jacques and Pierre Curie discovered that pressure
applied to a quartz crystal creates an electrical potential
on the crystal. Likewise, they also discovered that an
electrical potential impressed on the crystal creates. Read
More>> |
Calc. effective capacitance vs frequency
Impedance matching applications where minimum temperature
drift is critical, this approach will save you time & money during development. Read
More>> |
Calculations for RF Coax Designs
Calculate the Impedance, Phase, Capacitance, Delay, Velocity
of Propagation & Attenuation of a coax design. Read
More>> |
Thermal MGMT in RF Power Amps
A few quick calculations of the dissipated power in the
RF Capacitor is critical, so knowing the ESR and matching impedances
are key to achieving trouble free operation in RF Power Amp
circuits. Read
More>> |
|
Thermal Considerations for RF Resistors
Substrate material changes due to health concerns lead
to in-depth research on how to make thermal measurements.
The elimination of BeO from RF Resistive products resulted
in a materials analysis before you can be assured of a
reliable design in your RF Couplers or RF Ferrite Circulator/Isolator applications. Read
More>> |
Contact Gary for a listing of items. His 20 years of design experience of magnetics and SMPS circuits can get you on the right track without wasting your valuable time. |
The single most important parameter
Equivalent Series Resistance (ESR) is the most important
parameter in selecting an RF Cap to fit the application.
It is the summation of all losses resulting. Read
More>> |
|
RF Cap Mechanical Placement Orientation
Many RF Chip Caps are typically surface mounted on a microstrip.
Mounting can be with the electrodes parallel or perpendicular
to the microstrip. Read
More>> |
|
