Direct solder-to-copper PCB process for High Power
Custom Assembly, a subsidiary of Phoenix Co. of Chicago, has qualified a
new PCB process used for high Power RF Amplifier applications. This direct solder-to-copper
process allows customers to reduce the physical size of their power amplifiers while maintaining
high reliability. Read
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ATC 550L UBC Ultra-Broadband Capacitors
The latest in a series of UBC Capacitor developments was released by ATC. The 550L Series is Lower Cost
than its predecessors and achieves flat performance across a wider bandwidth than either our 530L or 545LSeries.
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ATC 800R - The Industries New GOLD Standard
ATC continues to lead the industry when it comes to high performance Ultra-Low ESR RF MLCs, with the release
of their New 800 dielectric. The 800 provides the user true bandwidth operation while achieving the industry's lowest ESR
across broad band widths. The R case size has set new GOLD standards for the industry, operating at the highest achievable
RF current levels than any MLC in the industry. Read
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GPS Antenna for handheld and Mobile Applications
Phoenix Co. of Chicago has introduced a line of Active and Passive integrated GPS Antennas for
your Handheld or Mobile application. These robust designs are integrated into the connector housing to protect
and meet the harshest environments that you can throw their way.
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MIL-CON introduces Aerospace Data Connectors
MIL-CON , a subsidiary of Phoenix Co. of Chicago, has introduced a robust high speed
data connector series for your defense or aerospace application. Capable of integrating power, signal,
or RF, these cost effective connectors are designed for the harshest environments on the planet.
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Nitronex 15 Watt Plastic GaN HEMT for WiMAX
Nitronex has released a new 15W GaN HEMT built using their SIGANTIC® process, a
mature GaN on Si platform. Nitronex offers this device in a plastic SMT package targeted for
3.5GHz WiMAX applications. It features leading-class RCE and EVM performance to help meet your 802.16e
specs. Performance highlights include an EVM of less than 2% @ 1.5W with a single carrier OFDM waveform,
along with high efficiency and gain of 10.5dB.
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Nitronex 50 Watt GaN HEMT for WiMAX
Nitronex has released a 50W GaN HEMT built using their SIGANTIC® process. Nitronex is targeting
the 3.5GHz WiMAX markets as this device features leading-class RCE and EVM performance to help meet your 802.16e
specs. Performance highlights include an EVM of less than 2.5% @ 6W with a single carrier OFDM waveform, along with
high efficiency and gain of 11dB.
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Phoenix Integrated Filtered Connectors
Phoenix Co. of Chicago has introduced a complete line of integrated Filtered Connectors to eliminate those unwanted and unknown
sources of noise in your cables and interconnects. These products are custom designed to fit your application electrically,
mechanically and environmentally. Contact your account MRE to discuss the details to provide you with a quick and precise
response to what can be achieved. For more information, these following D-Sub and Filter Plate fact sheets can be reviewed
before your next meeting.
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Q3 Lab SMT High-Q RF Ceramic Resonators
Q3 Lab has introduced a complete line of SMT RF Coaxial Ceramic Resonators with the industry's
highest Q achievable for a given size. These resonators outperform all others with 25 to 30% higher Q's for your
onboard filter and VCO applications. Contact your account MRE for additional information.
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SMT Isolators from Renaissance Electronics
Renaissance Electronics has introduced a Series of broadband SMT Isolators and Circulators. These
devices can cover an octave of operating frequency and provide high reliability through its SMT packaging approach,
reducing size, weight and costs by eliminating expensive packaging and connectors typically used for the interface
into your PCB circuit.
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Tekmos replaces vulnerable FPGA
Tekmos ASIC semiconductor process allows customers with obsolesces or vulnerability concerns the
option of moving to a more reliable ASIC approach for their new or legacy product redesign.
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Tekmos introduces one HOT Process
Tekmos has introduced a New ASIC semiconductor process that allows operation in 175oC or 225oC
environments for your temperature critical program that many ASIC, FPGA and standard micro-controller
products require.
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